The wait has almost come to an end. The most awaited tipped flagship of the QUALCOMM, Snapdragon 845 is about to be launched next month that is December 2017. According the “weibo” post the rumored date of its release is to be in between December 04 to December 10.
Snapdragon 845 – Whats New!
The beast in talks is being manufactured through 10nm “LOW POWER EARLY [LPE] FinFET” process. It is expected to run 4 ARM cortex A-75 cores and 4 ARM cortex A-53 cores. It is being paired with “ARDENO 630 GPU”, which is going to be a great boon, as and when they both come together it means that this combination is going to be deadly superfast combination.
Snapdragon 845 – The boost to VR!
The processor is being optimized for augmented reality (AR) and virtual reality (VR), as these two features are going to be the manufactures main focus in this modern Smartphone era. This processor is being rumored to get the “KRYO cores and X20 connectivity”, which can provide download speeds of up to 1.2 GBPS, that’s whooping number isn’t it!!!!!
Snapdragon 845 – The debutante phone!
The first to come up with this Snapdragon 845 processor will the XIAOMI’s next flagship MI 7. Past rumors suggested that the SAMSUNG was supposed to debut with this thing with its next flagship GALAXY S9 and GALAXY S9 PLUS. But due to MI 7 which will be launched before SAMSUNG GALAXY series in the month of FEBRUARY will come up with the 845 processor.
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The new Snapdragon 845 processor is absolutely worth waiting for. It’s going to be damn interesting to see whether it will be strong enough to compete with the other processor’s, mainly the HUWAEI’s KIRIN 970 superfast processor which has taken the world apart with its new “NPU” (neural processing unit) technology. This is surely going be a tough competition between the two tech processors.